Date:2026-09-24 Categories:Product knowledge Hits:154 From:Guangdong Youfeng Microelectronics Co., Ltd
The structural composition of integrated circuits mainly includes:
1. Circuit design: refers to the circuit design of integrated circuits, including logic design, physical design, etc.
2. Wafer processing: refers to the process of converting circuit designs into patterns on a wafer, and transferring the circuit patterns onto the wafer through photolithography and other techniques.
3. Wafer testing: refers to testing the circuits on the wafer to determine if they are functioning properly. diode
4. Cutting and packaging: Refers to cutting wafers into chips and then packaging them.
5. Testing and verification: refers to testing the packaged chip to verify whether its performance meets the requirements. diode
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