What is thick-film integrated circuit, the basic structure of thick-film integrated circuit, thick-film materials, characteristics, working principles, main processes, applications, and testing methods 2

5. Strong adaptability: Due to the simple and flexible manufacturing process of thick film integrated circuits, various shapes and sizes of circuits can be manufactured, suitable for different application scenarios.

4、 Working principle: diode

The working principle of thick film integrated circuits is similar to traditional integrated circuits, which achieve circuit functions through the combination and connection of components such as conductors, resistors, capacitors, inductors, etc. Conductors are used to connect various components and circuit structures, resistors are used to adjust the resistance value of circuits, capacitors are used to store and release charges, and inductors are used to store and release magnetic energy. By forming thick film circuits on ceramic or glass substrates, complex circuit functions can be achieved.

5、 Main process:

The main processes of thick film integrated circuits include:

1. Substrate preparation: Select a suitable ceramic or glass substrate and perform surface treatment such as cleaning, degreasing, etc.

2. Preparation of thick film materials: Select suitable thick film materials, such as conductive materials such as gold, silver, copper, as well as insulating materials such as glass and ceramics. The methods for preparing thick film materials include spraying, printing, etc.

3. Circuit design and layout: Based on the functional requirements of the circuit, design a circuit diagram and determine the layout and connection method of components.

4. Thick film printing: Printing thick film materials onto a substrate to form components such as conductors, resistors, capacitors, inductors, etc. in circuit diagrams.

5. Sintering: Sintering the printed thick film circuit to tightly bond the conductor and substrate, and solidify the thick film material.   diode

6. Component connection and packaging: Connect various components as needed and package them.

7. Testing and debugging: Test and debug the manufactured thick film integrated circuit to ensure its normal functionality.