Overview of the use of field-effect transistor amplifiers 1

Judgment of the quality of field-effect transistors and precautions during use

Precautions for using MOS field-effect transistors diode

When using MOS field-effect transistors, attention should be paid to classification and they cannot be interchanged arbitrarily. Due to high input impedance (including MOS integrated circuits), MOS field-effect transistors are prone to electrostatic breakdown. The following rules should be noted when using them:

1. MOS devices are usually packed in black conductive foam plastic bags when they leave the factory. Do not take a plastic bag randomly. Thin copper wires can also be used to connect the pins together, or tin foil can be used for packaging.

2. The removed MOS device cannot slide on the plastic board, and a metal disk should be used to hold the standby device.

3. The soldering iron used for welding must be well grounded.diode

4. Before soldering, the power and ground wires of the circuit board should be short circuited, and then separated after the MOS devices are soldered.diodeThe soldering sequence of each pin of MOS devices is drain, source, and gate. The order of disassembly is reversed.

Before installing the circuit board, use a grounded wire clamp to touch the various wiring terminals of the machine, and then connect the circuit board.

7. It is recommended to connect a protective diode to the gate of a MOSFET under permissible conditions. When repairing the circuit, attention should be paid to verifying whether the original protective diode is damaged.