OPA445 is a high-voltage field-effect transistor input operational amplifier 9

5. Connect all holes to an internal power plane with the correct voltage potential (V -).

6. Do not use typical web or spoke connection methods when connecting these holes to a flat surface. The network connection has a high thermal resistance connection, which helps to slow down heat transfer during welding operations, making it easier to weld through holes with planar connections. However, in this application, low thermal resistance is required to achieve the most efficient heat transfer. Therefore, the holes under the OPA445 PowerPAD package should be connected to the internal plane and fully connected around the entire plated through-hole.diode

7. The top welding mask should expose the encapsulated terminals and hot solder pad areas. The bottom welding mask should cover the holes in the hot solder pad area. This masking can prevent the solder from being pulled away from the hot pad area during reflow soldering.diode

8. Apply solder paste to the exposed hot pad area and all IC terminals.

9. With these preparation steps, the PowerPAD IC can be easily placed in place and perform solder reflow soldering operations like any standard surface mount component. This preparation work can ensure the correct installation of the parts.

For detailed information about the PowerPAD software package, including thermal modeling considerations and repair procedures, please refer to the technical brief SLMA002 PowerPAD Thermal Enhancement Package.diode