OPA445 is a high-voltage field-effect transistor input operational amplifier 7

PowerPAD Thermal Enhancement Components

In addition to the SO-8, DIP-8, and to-99 software packages, OPA445 also comes with an SO-8 PowerPAD. SO-8 PowerPAD is a standard sized SO-8 package, and the exposed lead frame at the bottom of the package can be directly soldered to the PCB, resulting in extremely low thermal resistance. This structure greatly enhances the power consumption capability of OPA445 and eliminates the use of bulky heat sinks and plugs traditionally used for thermal packaging. diode This package can be easily installed using standard PCB assembly techniques. Note: As the pins of SO-8 PowerPAD are compatible with the standard SO-8 package, OPA445 can directly replace operational amplifiers in existing sockets. PowerPAD always needs to be soldered to the PCB, even for low-power applications. Weld the device onto the PCB and provide necessary thermal and mechanical connections between the lead frame die pad and the PCB.diode

The design of PowerPAD packaging exposes the lead frame mold pad (or thermal pad) at the bottom of the IC; Refer to Figure 13. This design provides an extremely low thermal resistance (JC) path between the mold and the external packaging. The heat pad at the bottom of the IC can be directly soldered onto the PCB, using the PCB as a heat sink. In addition, electroplated through holes (vias) provide a low thermal resistance hot runner for the back of the PCB.diode